Materials |
Density (g/cm³) |
Thermal Conductivity W/moK |
CTE, ppm/°K 20-100℃ |
|
Copper Metal Laminate |
1:1:1 Cu/Mo/Cu |
9.27-9.47 |
300-310 (x-y) 220-230 (z) |
9.6-10.0 |
1:2:1 Cu/Mo/Cu |
9.48-9.68 |
270-280 (x-y) 200-210 (z) |
8.5-8.9 | |
1:3:1 Cu/Mo/Cu |
9.6-9.8 |
240-250 (x-y) 180-190 (z) |
7.7-8.1 | |
1:4:1 Cu/Mo/Cu |
9.7-9.9 |
210-220 (x-y) 170-180 (z) |
6.8-7.2 | |
1:5:1 Cu/Mo/Cu |
9.74-9.94 |
195-200 (x-y) 165-170 (z) |
6.2-6.6 | |
13:74:13 Cu/Mo/Cu |
9.78-9.98 |
210-220 (x-y) 220-230 (z) |
5.7-6.1 | |
1:7:1 Cu/Mo70/Cu |
9.46 |
300-310 (x-y) 170-180 (z) |
7.2 |
Tag: Tungsten Rhenium Thermocouple | High Temperature Resistance Tungsten Wire | Tungsten Thermocouple | High Temperature Resistance Tungsten Thermocouple
Tag: Tungsten Target | Tungsten Anode Target | Ground Tungsten Target | Tungsten Sputtering Target